1775738-9 datasheet

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О ДАТАШИТЕ

• Маркировка
  1775738-9
• Производитель
  TE Connectivity
• Описание
  TE Connectivity 1775738-9 Applies To: Printed Circuit Board Assembly Process Feature: Without Pick and Place Cover Contact Plating, Mating Area, Material: Gold Contact Plating, Mating Area, Thickness (?µm [??in]): 0.762 [30] Contact Termination Type: Surface Mount Gender: Receptacle Housing Color: Black Industry Standard: USB 2.0 Lead Free Solder Processes: Reflow solder capable to 245?°C, Reflow solder capable to 260?°C Led: Without Locating Post(s): With Locking Feature: Without Mount Location: Top Number Of Ports: 1 Number Of Positions: 5 Orientation: Right Angle Packaging Method: Tube Panel Ground: Without Pcb Mount Retention Type: SMT Hold Down Pcb Thickness, Recommended (mm [in]): 1.60 [0.063] Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Series: B Shell Plating: Nickel Size: Mini Termination Method: Solder Usb-if Test Id Number (tid): Not Submitted For Testing
• Количество страниц
  3 шт.
• Форматы файла
  HTML, PDF

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